South Korea Molded Interconnect Devices (MID) Market Insight
Published: 20 May 2026 | Report Format: Electronic (PDF)
The growth of South Korea’s market for molded interconnect devices (MIDs) is estimated to be 10.1% per year, owing to rising demands for miniature electronic components, growing usage of 3D circuit technology, and the growing application of advanced automobile, medical, and consumer electronic systems that enhance miniaturization, connectivity, and efficiency in manufacturing processes.
South Korea Molded Interconnect Devices (MID) Market Insights Forecasts to 2035
- The South Korea Molded Interconnect Devices (MID) Market Size Was Estimated USD 176 Million in 2025
- The Market Size is Expected to Grow at a CAGR of around 10.1% from 2025 to 2035
- The South Korea Molded Interconnect Devices (MID) Market Size is Expected to reach around USD 461 Million by 2035
Notable Insights for the South Korea Molded Interconnect Devices (MID) Market
- By product type, the Laser Direct Structuring (LDS) molded interconnect devices segment is dominating, accounting for over approx. 63% in the South Korea Molded Interconnect Devices Market in 2025.
- By application, the automotive electronics and consumer devices segment is dominating, accounting for approximately 58% of the South Korea Molded Interconnect Devices Market share in 2025.
- Samsung Electro-Mechanics Co., Ltd. has achieved revenues of approximately KRW 10.6 trillion in fiscal year 2025, thanks to high growth in semiconductor substrates, miniaturized electronic modules, and component integration technology.
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- The government policies that support semiconductor localization, intelligent manufacturing in automotive industry, and next generation electronics innovations are boosting the South Korea Molded Interconnect Devices Market, owing to advanced 3D circuit integration technology and artificial intelligence enabled manufacturing systems which improve assembly efficiency by 32-41% and minimize miniaturization complexity by 24-33% in automotive electronics, wearable devices, telecommunication, health care equipment and industrial IoT application sectors.
Competitive Analysis:
The report offers the appropriate analysis of the key organizations/companies involved within the South Korea Molded Interconnect Devices (MID) Market, along with a comparative evaluation primarily based on their product of offering, business overviews, geographic presence, enterprise strategies, segment market share, and SWOT analysis. The report also provides an elaborative analysis focusing on the current news and developments of the companies, which includes product development, innovations, joint ventures, partnerships, mergers & acquisitions, strategic alliances, and others. This allows for the evaluation of the overall competition within the market.
Top Companies in South Korea Molded Interconnect Devices (MID) Market
- Samsung Electro-Mechanics Co., Ltd.
- LG Innotek Co., Ltd.
- Molex LLC
- LPKF Laser & Electronics SE
- TE Connectivity Ltd.
- Amphenol Corporation
- DSM Engineering Materials
- Schweizer Electronic AG
- Mitsubishi Engineering-Plastics Corporation
- Basel AG
Recent Developments:
- In October 2024, LG Innotek expanded its advanced electronic component manufacturing portfolio with next-generation 3D molded interconnect technologies for automotive electronics and AI-enabled smart devices, strengthening miniaturized circuit integration capabilities across South Korea.
- In June 2023, LPKF Laser & Electronics introduced enhanced laser direct structuring solutions for compact MID manufacturing applications, improving precision circuit integration and reducing electronic assembly complexity for high-density electronic devices.
Market Segmentation:
South Korea Molded Interconnect Devices (MID) Market, By Product Type
- Laser Direct Structuring (LDS) MID
- Two-Shot Molding MID
- Film Technique MID
- Printed Electronics MID
- 3D Circuit Carrier MID
South Korea Molded Interconnect Devices (MID) Market, By Technology
- 3D Circuit Integration Technologies
- Laser Structuring Technologies
- AI-Integrated Smart Manufacturing Systems
- Miniaturized Electronic Packaging Technologies
- Advanced Polymer Electronics Systems
South Korea Molded Interconnect Devices (MID) Market, By Application
- Automotive Electronics
- Consumer Electronics & Wearables
- Telecommunications Equipment
- Healthcare & Medical Devices
- Industrial IoT & Smart Automation
Expert Views:
Some of the drivers that would propel the market for molded interconnect devices in South Korea include growing investments in miniaturized semiconductor packaging technology, growing use of smart automotive electronics, and growing adoption of miniaturized IoT-enabled devices. Advanced platforms of 3D circuit integration, smart laser structuring techniques, and new generation miniaturized electronic manufacturing technologies would improve connectivity, efficiency, and digital manufacturing technologies in automotive electronics, consumer products, telecommunication, healthcare systems, and industrial automation.
Author: Govind and Krishna By Spherical Insights and Consulting